UNIWERSYTET MorskI w gdyni

                  Katedra Elektroniki Morskiej

Publikacje

2017

1. K. Górecki, J. Zarębski, P. Górecki, S.Halbryt: The power supply of the hydrogen generator. 3rd International Congress on Energy Efficiency and Energy Related Materials (ENEFM2015), Springer Proceedings in Energy, 2017, pp. 221-227.

2. P. Górecki, K. Górecki, E. Krac, J. Zarębski: The use of photo-voltaic panels to charge mobile electronic devices. 3rd International Congress on Energy Efficiency and Energy Related Materials (ENEFM2015), Springer Proceedings in Energy, 2017, pp. 229-234.

3. J. Dąbrowski, E. Krac, K. Górecki: Analysis of long-time efficiency of the photovoltaic installation. Przegląd Elektrotechniczny, R. 93, nr 2, 2017, s. 202-205.

4. K. Górski, K. Górecki: Modelling thermal properties of planar transformers. Przegląd Elektrotechniczny, R. 93, nr 2, 2017, s. 206-209.

5. K. Górecki, D. Bisewski, J. Zarębski, R. Kisiel, M. Myśliwiec: Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case. Circuit World, Vol. 43, No. 1, 2017, pp. 38-42.

6. P. Ptak, K. Górecki, J. Zarębski: Układy zasilające stosowane w lampach LED. Przegląd Elektrotechniczny, R. 93, nr 3, 2017, s. 167-170.

7. K. Detka, K. Górecki, J. Zarębski: Modeling single inductor dc - dc converters with thermal phenomena in the inductor taken into account. IEEE Transactions on Power Electronics, Vol. 32, No. 9, 2017, pp. 7025-7033.

8. P. Ptak, K. Górecki, J. Zarębski: Badanie wybranych właściwości lamp LED. XL Konferencja z Podstaw Elektrotechniki i Teorii Obwodów SPETO 2017, Ustroń, 2017, s. 79-80.

9. J. Dąbrowski, K. Niklaszewski, K. Górecki: Badanie wpływu zacienienia i wygięcia na charakterystyki elastycznego panelu fotowoltaicznego. Elektronika, nr 5, 2017, s.24-27.

10. P. Górecki, K. Górecki, J. Zarębski: Modelowanie właściwości elektrolizera w programie SPICE. XVI Krajowa Konferencja Elektroniki KKE, Darłowo, 2017, s. 189-194.

11. Górecki K., Górski K., Zarębski J.: Investigations on the Influence of Selected Factors on Thermal Parameters of Impulse-Transformers. Informacije MIDEM – Journal of Microelectronics, Electronic Components and Materials, Vol. 47, No. 1, 2017, pp. 3-13.

12. P. Górecki, K. Górecki, J. Zarębski: Thermal model of the IGBT module. Proceedings of Microtherm 2017 Microtechnology and Thermal problems in Electronics, Łódź, 2017, pp. 32-34.

13. K. Górecki, K. Detka: Investigations of the influence of frequency on power losses in ferrite cores. Proceedings of Microtherm 2017 Microtechnology and Thermal problems in Electronics, Łódź, 2017, pp. 74-76.

14. K. Górecki, K. Górski: Modelling nonisothermal electrical characteristics of ferrite cores, Proceedings of Microtherm 2017 Microtechnology and Thermal problems in Electronics, Łódź, 2017, pp. 77-79.

15. P. Górecki, K. Górecki, J. Zarębski: Badanie właściwości wybranych modeli tranzystorów bipolarnych z izolowaną bramką. Przegląd Elektrotechniczny, R. 93, Nr 7, 2017, s. 81-85.

16. K. Górecki, J. Dąbrowski, E. Krac, J. Zarębski: Modelling the influence of weather conditions on properties of the photovoltaic installation. Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems Mixdes 2017, Bydgoszcz 2017, pp. 366-371.

17. K. Górecki, K. Górski: Compact thermal model of planar transformers. Proceedings of the 24th International Conference Mixed Design of Integrated Circuits and Systems Mixdes 2017, Bydgoszcz 2017, pp. 345-350.

18. K. Górecki, P. Górecki: Modelling dynamic characteristics of the IGBT with thermal phenomena taken into account. Microelectronics International, Vol. 34, No. 3, 2017, pp. 160-164.

19. K. Detka, K. Górecki: Modelling power losses in ferromagnetic materials. Material Science Poland, Vol. 35, No. 2, 2017, pp. 398-404.

20. P. Górecki, K. Górecki: Influence of thermal phenomena on characteristics
of components of the IGBT module.
21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, Warszawa, 2017, Contribution_174

21. K. Górecki, P. Ptak: Modelling power LEDs in the COB case with thermal phenomena taken into account. 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, Warszawa, 2017, Contribution_173

22. K. Górecki, B. Dziurdzia, P. Ptak: The influence of a soldering manner on thermal properties of LED modules. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Contributtion_i108

23. P. Górecki, K. Górecki: Non-linear compact thermal model of IGBTs. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Contributtion_i114

24. K. Detka, K. Górecki: Measurements of transient thermal impedance of ferrite cores. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Contributtion_i115

25. K. Górecki, K. Górski: Non-linear thermal model of planar transformers. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Contributtion_i116

26. K. Górecki, B. Dziurdzia, P. Ptak: The influence of a soldering manner on thermal properties of LED modules. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Full, Contributtion_i108_156

27. P. Górecki, K. Górecki: Non-linear compact thermal model of IGBTs. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Full, Contributtion_i114_157

28. K. Detka, K. Górecki: Measurements of transient thermal impedance of ferrite cores. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Full, Contributtion_i115_159

29. K. Górecki, K. Górski: Non-linear thermal model of planar transformers. 41st International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warszawa, 2017, Full, Contributtion_i116_160

30. P. Górecki, K. Górecki, J. Zarębski: Modelowanie właściwości elektrolizera w programie SPICE. Elektronika, nr 10, 2017, s. 15-18.

31. P. Górecki, K. Górecki, J. Zarębski: Modelling the temperature influence on dc characteristics of the IGBT. Microelectronics Reliability, Vol. 79, 2017, pp. 96-103.

32. K. Górecki, P. Ptak: Modelling LED lamps in SPICE with thermal phenomena taken into account. Microelectronics Reliability, Vol. 79, 2017, pp. 440-447.

33. P. Ptak, K. Górecki, J. Zarębski: Investigations of the selected properties of LED lamps. Prace Naukowe Politechniki Śląskiej "Elektryka" 2017, nr 1 (240), s. 7-13.

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